dor_id: 45775

506.#.#.a: Público

590.#.#.d: Los artículos enviados a la revista "Journal of Applied Research and Technology", se juzgan por medio de un proceso de revisión por pares

510.0.#.a: Scopus, Directory of Open Access Journals (DOAJ); Sistema Regional de Información en Línea para Revistas Científicas de América Latina, el Caribe, España y Portugal (Latindex); Indice de Revistas Latinoamericanas en Ciencias (Periódica); La Red de Revistas Científicas de América Latina y el Caribe, España y Portugal (Redalyc); Consejo Nacional de Ciencia y Tecnología (CONACyT); Google Scholar Citation

561.#.#.u: https://www.icat.unam.mx/

650.#.4.x: Ingenierías

336.#.#.b: article

336.#.#.3: Artículo de Investigación

336.#.#.a: Artículo

351.#.#.6: https://jart.icat.unam.mx/index.php/jart

351.#.#.b: Journal of Applied Research and Technology

351.#.#.a: Artículos

harvesting_group: RevistasUNAM

270.1.#.p: Revistas UNAM. Dirección General de Publicaciones y Fomento Editorial, UNAM en revistas@unam.mx

590.#.#.c: Open Journal Systems (OJS)

270.#.#.d: MX

270.1.#.d: México

590.#.#.b: Concentrador

883.#.#.u: https://revistas.unam.mx/catalogo/

883.#.#.a: Revistas UNAM

590.#.#.a: Coordinación de Difusión Cultural

883.#.#.1: https://www.publicaciones.unam.mx/

883.#.#.q: Dirección General de Publicaciones y Fomento Editorial

850.#.#.a: Universidad Nacional Autónoma de México

856.4.0.u: https://jart.icat.unam.mx/index.php/jart/article/view/160/157

100.1.#.a: Kuo, Jian Long; Cheng, Ming Te

524.#.#.a: Kuo, Jian Long, et al. (2014). Optimal Yield Rate in ACF Cutting Process of TFT-LCD Module Using Orthogonal Particle Swarm Optimization Based on Response Surface Design. Journal of Applied Research and Technology; Vol. 12 Núm. 6. Recuperado de https://repositorio.unam.mx/contenidos/45775

245.1.0.a: Optimal Yield Rate in ACF Cutting Process of TFT-LCD Module Using Orthogonal Particle Swarm Optimization Based on Response Surface Design

502.#.#.c: Universidad Nacional Autónoma de México

561.1.#.a: Instituto de Ciencias Aplicadas y Tecnología, UNAM

264.#.0.c: 2014

264.#.1.c: 2014-12-01

653.#.#.a: ACF cutting process; TFT-LCD; response surface method (RSM); plasma clean; orthogonal particle swarm optimization (OPSO)

506.1.#.a: La titularidad de los derechos patrimoniales de esta obra pertenece a las instituciones editoras. Su uso se rige por una licencia Creative Commons BY-NC-SA 4.0 Internacional, https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode.es, para un uso diferente consultar al responsable jurídico del repositorio por medio del correo electrónico gabriel.ascanio@icat.unam.mx

884.#.#.k: https://jart.icat.unam.mx/index.php/jart/article/view/160

001.#.#.#: 074.oai:ojs2.localhost:article/160

041.#.7.h: eng

520.3.#.a: Anisotropic Conductive Film (ACF) is essential material in LCM (Liquid Crystal Module) process. It is used in bondingprocess to make the driving circuit conductive. Because the price of TFT-LCD is getting lower than before in recentyears, the ACF has relatively higher cost ratio. The conventional long bar ACF cutting unit is changed into short barACF cutting unit in new bonding technology. However, the new type machine was not optimized in process controland mechanical design. Therefore, the failure rate of new ACF cutting process is much higher than the one of theconventional process. This wastes the ACF material and rework cost is considerably large. How to make themanufacturing cost down effectively and promote the product quality is the main issue to maintain competitioncapability for the product. Therefore, the orthogonal particle swarm optimization (OPSO) is used to analyze theoptimal design problem. The ACF cutting yield rate is selected to be objective function for optimization. The qualitycharacteristic function for yield rate is used in orthogonal particle swarm optimization. Three control factors such asplasma clean speed, ACF peeling speed and ACF cutter spring setting are selected to study the effect of the yieldrate. Results show that the proposed method can provide good optimal solution to improve the ACF cutting processfor TFTLCD manufacturing process.

773.1.#.t: Journal of Applied Research and Technology; Vol. 12 Núm. 6

773.1.#.o: https://jart.icat.unam.mx/index.php/jart

022.#.#.a: ISSN electrónico: 2448-6736; ISSN: 1665-6423

310.#.#.a: Bimestral

264.#.1.b: Instituto de Ciencias Aplicadas y Tecnología, UNAM

doi: https://doi.org/10.1016/S1665-6423(14)71675-X

harvesting_date: 2023-11-08 13:10:00.0

856.#.0.q: application/pdf

last_modified: 2024-03-19 14:00:00

license_url: https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode.es

license_type: by-nc-sa

_deleted_conflicts: 2-1334df8b1819138cd1e68669f72dce22

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