dor_id: 45416

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856.4.0.u: https://jart.icat.unam.mx/index.php/jart/article/view/557/553

100.1.#.a: Alvarez Romero, G. A.; Ramírez Silva, M. T.; Rojas Hernández, A.; Hernández Rodríguez, P. R.

524.#.#.a: Alvarez Romero, G. A., et al. (2005). Monitoring of the PH using ISFET sensors in electroplating processes. Journal of Applied Research and Technology; Vol. 3 Núm. 03. Recuperado de https://repositorio.unam.mx/contenidos/45416

245.1.0.a: Monitoring of the PH using ISFET sensors in electroplating processes

502.#.#.c: Universidad Nacional Autónoma de México

561.1.#.a: Instituto de Ciencias Aplicadas y Tecnología, UNAM

264.#.0.c: 2005

264.#.1.c: 2005-12-01

653.#.#.a: ISFET; Electroplating; Sensor

506.1.#.a: La titularidad de los derechos patrimoniales de esta obra pertenece a las instituciones editoras. Su uso se rige por una licencia Creative Commons BY-NC-SA 4.0 Internacional, https://creativecommons.org/licenses/by-nc-sa/4.0/legalcode.es, para un uso diferente consultar al responsable jurídico del repositorio por medio del correo electrónico gabriel.ascanio@icat.unam.mx

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041.#.7.h: eng

520.3.#.a: It is well known that electroplating with metals has achieved quite a significant importance and has become a lucrative area. The present paper looks at the electroplating processes as a part of the metallurgical industry that are carried out with diverse aims. The quality and characteristics of the metal deposit depend on the electrochemical conditions imposed, such as pH. During an industrial electroplating process, when an undesirable change is detected first in the metal coating attained, is a common occurrence that a complete change of the plating bath is carried out. Due to this, the application of analytical systems to enable in situ precise monitoring of any compositional changes of the bath during the electroplating process, is an unquestionable need to be carefully satisfied. The design of such systems should allow close control of the concentrations of specific components during the process, constituting thus a desirable aim entailing both, financial and time savings. In the present work, the construction of an analytical system based on the coupling of a continuous sampling system with pH ISFET sensors is described. Comparative studies between a glass electrode and the proposed analytical system in copper, silver and nickel electroplating baths are carried out.

773.1.#.t: Journal of Applied Research and Technology; Vol. 3 Núm. 03

773.1.#.o: https://jart.icat.unam.mx/index.php/jart

022.#.#.a: ISSN electrónico: 2448-6736; ISSN: 1665-6423

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doi: https://doi.org/10.22201/icat.16656423.2005.3.03.557

harvesting_date: 2023-11-08 13:10:00.0

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245.1.0.b: Monitoring of the PH using ISFET sensors in electroplating processes

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Artículo

Monitoring of the PH using ISFET sensors in electroplating processes

Alvarez Romero, G. A.; Ramírez Silva, M. T.; Rojas Hernández, A.; Hernández Rodríguez, P. R.

Instituto de Ciencias Aplicadas y Tecnología, UNAM, publicado en Journal of Applied Research and Technology, y cosechado de Revistas UNAM

Licencia de uso

Procedencia del contenido

Cita

Alvarez Romero, G. A., et al. (2005). Monitoring of the PH using ISFET sensors in electroplating processes. Journal of Applied Research and Technology; Vol. 3 Núm. 03. Recuperado de https://repositorio.unam.mx/contenidos/45416

Descripción del recurso

Autor(es)
Alvarez Romero, G. A.; Ramírez Silva, M. T.; Rojas Hernández, A.; Hernández Rodríguez, P. R.
Tipo
Artículo de Investigación
Área del conocimiento
Ingenierías
Título
Monitoring of the PH using ISFET sensors in electroplating processes
Fecha
2005-12-01
Resumen
It is well known that electroplating with metals has achieved quite a significant importance and has become a lucrative area. The present paper looks at the electroplating processes as a part of the metallurgical industry that are carried out with diverse aims. The quality and characteristics of the metal deposit depend on the electrochemical conditions imposed, such as pH. During an industrial electroplating process, when an undesirable change is detected first in the metal coating attained, is a common occurrence that a complete change of the plating bath is carried out. Due to this, the application of analytical systems to enable in situ precise monitoring of any compositional changes of the bath during the electroplating process, is an unquestionable need to be carefully satisfied. The design of such systems should allow close control of the concentrations of specific components during the process, constituting thus a desirable aim entailing both, financial and time savings. In the present work, the construction of an analytical system based on the coupling of a continuous sampling system with pH ISFET sensors is described. Comparative studies between a glass electrode and the proposed analytical system in copper, silver and nickel electroplating baths are carried out.
Tema
ISFET; Electroplating; Sensor
Idioma
eng
ISSN
ISSN electrónico: 2448-6736; ISSN: 1665-6423

Enlaces